Chemical copper sinking process

With the electronics industry demanding more reliable, better performing, and more economical electroplating additive products, J-KEM International has developed a new chemical copper impregnation process for future electronic products. By introducing the latest generation of chemical technology into the entire process, it is specifically designed for the reliability needs of new end users.

The new J-KEM masterbatch has taken a big step in comparison with the conventional ones. The ordinary ones have low selectivity and form a light barrier (slight barrier) in the inner layer, which results in weak Cu-generation. Cu bond. The chemical activity of the J-KEM masterbatch is totally different from that of the former. It has extremely high efficiency, and it can form 100% Cu-Cu binding force and high epoxy and glass fiber absorption.

The J-KEM organopalladium activator is a key improvement throughout the J-KEM process. Through the innovative use of organic additives, the new palladium activator formulation shows absolutely superior catalytic performance compared to conventional palladium activators.

Therefore, even if the concentration of palladium in the working fluid is very low, such as 30 ppm, most of the high aspect ratio materials are deposited with thin copper, and excellent results can still be obtained by backlight testing.

J-KEM chemical copper deposition technology is stable and easy to control, and the deposition layer is crystal-clear and compact. The deposition exhibits lateral growth properties that allow copper to be well covered in the pores.

J-KEM chemical copper plating bath can improve the copper deposition layer and hole wall and circuit board surface binding ability.

J-KEM chemical copper plating baths are formulated using unique organic palladium activators for both vertical and horizontal plating.

J-KEM Alkaline Catalytic System is a unique optimization process that minimizes the alkalinity and high temperature for flexible printed circuit boards, and combines the high absorption performance of the whole-hole system, the properties of organopalladium activators, and the chemical copper deposition from With several features such as catalytic properties, J-KEM chemistry copper bath is a particularly prominent process for PI bonding.

Process features:

• Deep hole walls on all substrate surfaces can be well covered;

• Excellent performance for HARB's, base plate and blind vias;

• Extreme and outstanding pore wall adhesion;

• A new generation of palladium activator can work at very low concentrations (30ppm);

• Suitable for vertical and horizontal plating;

• J-KEM chemical copper deposition is the best process for flexible printed circuit boards;

• Economical savings.

Graphic plating process

J-KEM900 high-performance pickling agent, low foaming, easy to clean, also suitable for direct plating system.

J-KEM300 is a stable, non-ammonium mild type micro-etching agent with a high load on the continuous micro-etching of copper and is also suitable for direct electroplating systems.

J-KEMCu90H is a two-component new acid copper additive designed for obtaining a uniform, bright copper coating with excellent depth capability and dispersion performance, especially for high aspect ratio PCB production.

The J-KEMSn800 tin coating is used for etching, offering excellent coverage over a wide current density range.

Acid copper features and benefits:

• System current density ranges from 0.5 to 6A/dm2;

Superior plating performance, covering all CD ranges on high aspect ratio boards;

• Excellent surface dispersion for complex graphic designs.

• Excellent metallurgical properties.

Scrape removal process

According to different Tg values, the best results can be achieved. The same applies to the flexible printed circuit board technology.

Bulk:

Unique formula, high Tg material bulk effect is excellent.

Especially suitable for SBU process.

Scrape removal:

• Perfect micro-roughened structure.

• Work with a wide temperature range and get the best results based on different Tg values.

• The best Cu-Cu binding force.

neutralize:

• No etching occurs on the three junctions.

• Remove any residue on the copper surface.

J-KEM International is a world-renowned manufacturer of PCB specialty chemicals that integrates production, R&D and sales, and is committed to providing high-quality chemicals and process flow for the printed circuit board industry. The product range is perfect, covering the entire PCB process flow. The company is headquartered in Stockholm, Sweden and has branch offices in over 20 countries and regions. The company has the most advanced technology experience. Today, the company's customers are located in Europe, the Americas, Asia, the Pacific and neighboring countries and regions. Its products are sold in more than 100 countries and regions.
J-KEM International always adheres to the market, technology, experience and services. And with perfect technology, innovative thinking, standardized management model and the most advanced production equipment and testing methods to provide customers with high quality and comprehensive services.
J-KEM International implements the EU environmental policy, combines high-end technology and environmental awareness, and constantly develops high-quality, environmentally-friendly chemicals. With continuous innovation and technology, it guides world-leading technologies for PCB chemistry.

Guangzhou Dazhi Chemical Technology Co., Ltd. is a national high-tech enterprise integrating research, production, sales and service. It specializes in the production of electroplating intermediates, electroplating additives, PCB chemical additives, and electroplating special chemicals. It is the largest in China. One of the research and production bases for electroplating chemicals.

Dazhi Enterprise, as the support unit of the National Center for Electroplating Technology Productivity Promotion Center Guangzhou, takes the responsibility of revitalizing the national science and technology undertakings, invests a lot of resources in the formulation of national and industrial electroplating technology standards, and establishes it with domestic and foreign scientific research institutions and institutions of higher learning. In-depth and long-term cooperation. Since its inception, Dazhi Chemical has successively won the honors of the National Standard Establishment Unit, the Outstanding Unit for Standardization Work, the National High-tech Enterprise, the Guangzhou Private Technology Enterprise, and the National Electroplating Technology Productivity Promotion Center Guangzhou Center, and has passed ISO: 9001 Quality Management. System certification and ISO: 14001 environmental management system certification.

Dazhi Corporate is headquartered in Guangzhou Development Zone, China. Guangzhou Dazhi Chemical Technology Co., Ltd. acts as J-KEM International's regional distributor in China and is responsible for J-KEM International's total distribution and marketing of PCB chemicals in China.

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