According to the report of the American Physicist Organization Network, engineers at the University of California, Davis, invented an ultra-thin, highly viscous nanogel that can be used to process next-generation microchips. The study has been published in the recently published "Advanced Materials Magazine."

Pan Ting-rui, a professor of biomedical engineering at the university, said: “When the adhesive is peeled off, materials such as semiconductor flakes will break off, and the traditional glue forms a thick layer between the two surfaces, and the new nanometer The glue can be heat-transferred and printed, or it can be applied to a model, forming a layer that is only a few molecules thick.”

This nanogel is based on a transparent material called polydimethylsiloxane (PDMS). When it peels off on a smooth surface, it leaves a thin layer of sticky residue, which is often considered by researchers as an annoying thing. Dr. Pan and his colleagues realized that this kind of residue can be used as a substitute for glue, and its surface will be strengthened by oxidation.

Professor Pan said that this type of nanogel can be used to glue silicon wafers together to make a new multi-layer computer chip; it can also be applied to homes, such as making double-sided adhesive tapes or sticking objects to tiles. At present, this glue is only suitable for smooth surfaces and can be removed by heat treatment. (Hua Ling)

Floor Lamps

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• Warranty for bulbs :2 years

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