Three projects including “High-precision ultra-thin and ultra-hard material cutting wheel industrialization research†passed the appraisal and acceptance.
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The appraisal committee believes that:
The project of "High-precision ultra-thin and ultra-hard material cutting wheel industrialization research" has independently developed a large-scale production technology for the production of ultra-thin and super-hard material cutting wheels by pressing method. The product has high precision, thin thickness and large outer diameter range. Grinding wheel formula, grinding wheel base and abrasive layer high-strength bonding technology, grinding wheel blank forming, sintering and solidification process, grinding wheel precision processing technology, etc.; innovative 1A8, 1A1, 1A1R metal and resin bond ultra-thin cutting wheel Key technologies in the industrial production of series products. Its products have sharp cutting, good mold retention, long product life, high geometric accuracy of machining workpieces, and meet the requirements of high precision cutting in electronic information and machinery industries. The project has reasonable manufacturing process and stable product quality. It has been mass-produced in batches. The comprehensive performance of products produced by industrialization has reached the international advanced level, and the economic and social benefits are remarkable. The products can replace imports and the market prospect is broad.
The "Development of Superhard Material Grinding Disc for High-precision Double-face Grinding" has been innovative in the formulation of super-hard material grinding wheel for double-end ultra-precision grinding, which solves the uniform wear of the grinding plate, the precision machining of the grinding disc and the vertical dressing. Key technologies in technology and precision inspection technology. The grinding disc product developed can meet the requirements of high-precision precision grinding of double-end materials of various materials (cast iron, high-speed steel, ceramics, etc.). The grinding disc has the characteristics of high grinding efficiency, good durability, processing precision of workpiece and good surface quality. Its products have reasonable manufacturing process and stable quality. They have been mass-produced, and their comprehensive performance has reached the domestic leading level. It can replace imports and has significant economic and social benefits.
The "Research on the Diamond Grinding Tools for High-efficiency Ultra-precision Grinding of IC Wafers" is innovative in the preparation technology of low-temperature ceramic bond, the formulation and process of ceramic bond diamond grinding wheel, and the formulation and process of resin bond diamond grinding wheel. The ceramic bond diamond grinding wheel and the resin bond diamond grinding wheel developed by the project have high porosity, good self-sharpness, no secondary dressing, and high processing precision. The user's use shows that the resin bond diamond grinding wheel meets the requirements of coarse and fine grinding of 4-8 inch silicon wafers; the ceramic bond diamond grinding wheel meets the rough grinding processing requirements of 4-8 inch silicon wafer, which can replace imported and has good Economic and social benefits, the market has broad prospects. The project solves the key technology of high porosity, self-sharpness and high processing precision of grinding wheel products. It has achieved mass production and stable product quality, and its research results are at the domestic leading level.
High-precision ultra-thin and ultra-hard material cutting wheel series products are mainly used in ultra-precision cutting and grooving of different users and different materials in the electronic information industry. The success of its project marks that China's manufacturing technology for super-hard materials has reached a new stage and achieved new technological breakthroughs. To improve the technical level of the industry, promote technological progress in the industry, shorten the gap with the international advanced level; optimize the industrial structure and achieve industrial upgrading; it is an important driving role in accelerating the development of electronic information, reducing the production costs of enterprises in this field, and improving the economy. Benefits have an important role in promoting and promoting.
Double-end grinding discs are mainly used for precision grinding of workpieces such as core parts of air conditioners and refrigerator compressors (cylinders, slides, rolling sleeves, etc.), core parts of high-pressure vane pumps (blades, stators, rotors, etc.), which can replace imported ones. High performance grinding disc products. The successful development of the products of this project has greatly improved the manufacturing technology level of China's resin superhard material grinding discs, and reduced the production costs of enterprises in the fields of auto parts, hydraulic parts and air conditioner compressors.
IC silicon wafer high-efficiency ultra-precision grinding diamond grinding tools, including resin diamond grinding wheel and ceramic diamond grinding wheel, mainly used in wafer grinding in IC process and backside thinning of graphic silicon wafer in IC post-process. Silicon wafer thinning is an important part of the IC manufacturing system. The processing precision, surface roughness and surface integrity of the silicon wafer directly affect the line width of the IC and the performance of the IC chip. This project is aimed at the development trend of silicon wafer ultra-precision processing technology, and develops silicon wafer ultra-precision grinding diamond wheel with independent intellectual property rights to improve the manufacturing level and ultra-precision grinding technology of China's ultra-precision abrasive tools. The use of diamond products in the industry depends on the status quo of imports, promoting the localization process of the industry and narrowing the gap with the international advanced level are of great significance.