[Depth] Global semiconductor wafer industry development overview and trends (below)
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From the demand side, silicon demand began to recover and grow rapidly. The main factors are four aspects:
1) Global foundry manufacturers TSMC, Samsung Electronics, and Intel entered the high-end process technology competition, including TSMC's 7/10/16/28nm process, Intel invested 14/22nm process, and its capital expenditures reached 8 billion in the past three years. ~11 billion US dollars, as for UMC, Samsung and GlobalFoundries, etc., will continue to expand 28, 14nm process capacity;
2) Samsung, SK Hynix, Intel/Micron, Toshiba and other NAND Flash camps are fully committed to 3D NAND expansion to meet the needs of various 3D NAND chips for smartphone storage, solid state drives (SSD), eMMC/eMCP, etc. ;
3) Rapid acquisition of chips such as automotive semiconductors, CIS image sensors, and MCU microcontrollers;
4) The expansion of mainland semiconductor manufacturers is not a negligible force. The mainland has a total capacity of about 460,000 pieces per month for a 12-inch factory, and about 630,000 pieces of capacity in the construction of the city. The capacity of a 12-inch factory in the mainland will be as high as a single month. 1.09 million pieces, including 12-inch factory built by SMIC and other mainland manufacturers in Shanghai, Shenzhen, etc., as well as TSMC Nanjing Plant, UMC Xiamen Lianxin, Huali Micro 2 Factory, plus Fujian Quanzhou DRAM Factory, Wuhan Xinxin 3DNAND Plants, etc., the scale of production capacity increase is considerable. 
(1) Japan Shin-Etsu ShinEtsu
Shin-Etsu Chemical Co., Ltd. is Japan's leading chemical company and was founded in 1926. It currently employs more than 18,000 people worldwide and has R&D centers and manufacturing facilities in Asia, Europe, North America and South America. 
Japan's SUMCO was formerly known as Osaka Special Steel, which was founded in 1937. In 1992 and 1998, it merged with Kyushu Electronic Metals and Sumitomo Sitix Group. In 1998, it was renamed Sumitomo Metal Industries. In 1999, Sumitomo Metal Industries and Mitsubishi Materials and Mitsubishi Silicon Materials established a 300mm wafer manufacturing company, United Silicon Manufacturing. In 2002, Sumitomo Metal Industries' Silicon Manufacturing Division, United Silicon Manufacturing Company and Mitsubishi Silicon Materials Corporation merged to form Sumitomo Mitsubishi Silicon Corporation, and in 2005 changed its name to SUMCO Group. 
(3) Taiwan Global Wafers Global Wafers
The predecessor of Universal Wafer is the semiconductor business unit of SAS Sino-US Silicon Crystal Products Co., Ltd., which was founded in 1981 in Hsinchu Science and Technology Park. It is currently the largest 3 inch to 12 inch semiconductor silicon wafer in Taiwan. The material supplier also provides high quality solar wafers and ingots. In order to enable each of its divisions to have greater growth momentum and more significant business performance, Sino-US Silicon Crystal completed the independent division of the enterprise on October 1, 2011, officially split the semiconductor division into a global wafer share. Limited.
In 1999, SAS Sino-US Silicon Crystal Company established Kunshan Zhongchen Silicon Crystal Company in China to produce 6-inch and 8-inch semiconductor wafers. After 2011, it became a 100%-owned subsidiary of Global Wafer; SAS Sino-US Silicon Crystal Company In April 2008, it acquired US wafer manufacturer GlobiTech (production of 6-inch and 8-inch wafers). After 2011, it became a 100%-owned subsidiary of Global Wafer; Global Wafer acquired the global market in April 2012. Ranked sixth in Japan, Covalent Silicon, changed its name to GlobalWafers Japan in January 2013, and its products cover all sizes of semiconductor wafers.
In June 2016, Global Wafer acquired Danish Topsil Semiconductor Group for 100% DKK 320 million (approximately RMB 316 million) to produce 3 inch to 8 inch silicon wafer products; December 2016, Global Wafer announced the completion of its acquisition of SunEdision Semiconductor, the world's fourth largest wafer plant, at a price of US$683 million. Global Wafer is the world's third largest supplier of semiconductor wafers, with a market share of 17-19% expected in 2016.
Universal Wafer has a complete wafer line that can provide wafer products including: polished wafers, diffusers, annealed wafers, and epitaxial wafers. Product applications have spanned areas such as power management components, automotive power components, information communication components, and MEMS components.
(4) Siltronic, Germany
Siltronic AG is a semiconductor wafer supplier based in Munich, Germany. It was formerly founded in 1968 by Wacker-Chemitronic GmbH. In 1994, it was renamed Wacker Siltronic GmbH. In 2004, it was renamed Siltronic AG. Slitronic is the world's first company to introduce 300mm wafers.
The company's production base is currently located in Burghausen, Freiberg, Germany, Portland, and Singapore. Since January 2014, the company has established a joint venture with Samsung (the company holds 78%) and has operated the world's largest 200mm (230,000 pieces/month) and 300mm (325,000 pieces/month) wafer factory in Singapore. .
Siltronic currently supplies wafers to the world's top 20 wafer fabrication facilities, with the top ten customers accounting for 65% of the company's revenue in 2015. In 2008, the company's capacity utilization rate was only 60%, and now the capacity utilization rate in the second half of 2016 has reached 100%.
(5) US SunEdison Semiconductor
SunEdison was founded in 1959 by the American company Hughes Electronic Materials (MEMC), one of the world's founders of silicon materials. In 2009, MEMC acquired the unlisted SunEdison, the largest solar service provider in North America at the time, and changed its name to SunEdison in 2013. However, due to the fierce competition in the global photovoltaic industry, in 2013, the company split its subsidiary SunEdison Semiconductor (formerly MEMC's semiconductor silicon material business).
SunEdison after the spin-off of semiconductor silicon, due to the aggressive M&A expansion in recent years, and the global PV recession, resulting in high debt and deep financial crisis, and officially submitted Chapter11 bankruptcy protection application into bankruptcy reorganization in April 2016. stage. On August 28, 2016, GCL-Poly announced an agreement with SunEdison to acquire the assets of the latter and its affiliates, SunEdison Products Singapore, MEMC Pasadena, and Solaicx, for approximately US$150 million.
The spin-off SunEdison Semiconductor was officially listed on NASDAQ in May 2014. It has 4,400 employees by the end of 2015. The main manufacturing plants are in the US, Italy, Japan and Korea. In terms of semiconductor silicon materials, the company mainly provides 200mm and 300mm silicon wafers (PW polishing sheet, SOI insulator silicon, EPI epitaxial wafer, MDZ magic clean area wafer, etc.), which can be used for high-end logic devices, NAND/DRAM memory chips, MPU. /MCU, CIS, RF RF, analog / ASIC chips and other fields.
In October 2016, Taiwan wafer manufacturer Global Wafer acquired all of SunEdison Semiconductor's outstanding common stock for US$680 million (including SunEdisonSemiconductor's existing net debt). On December 6, 2016, the acquisition was officially completed, and Global Wafer became the world's third largest supplier of semiconductor silicon materials. The combined company will combine Global's top-of-the-line operational and market advantages with SunEdisonSemiconductor's global network and product development capabilities. Global Wafer is expected to significantly increase production capacity, increase product lines and global customer base, not only to expand customers in Korea and Europe, but also to acquire the technology and capacity of SOI wafers, and the financial scale will be significantly expanded.
(6) South Korea LG Siltron
LG Siltron is the only local semiconductor wafer manufacturer in Korea. The company was founded in 1993. In 1991, the company merged the wafer business unit of Lucky Advanced Materials in Korea and merged the wafer division of Dongyang Electronic Metals in Korea in 1995. In 1996, it launched a commercial mass production of 200mm silicon wafers, in 2002 300mm silicon wafers, and in 2014, 450mm silicon wafers.
The company currently supplies high-purity monocrystalline silicon ingots and polishing pads of different sizes (150mm/200mm/300mm/450mm) (for DRAM, FLASH, display driver, etc.) and epitaxial wafers (for MCU, CIS, power management). Chips and other fields).
China's semiconductor silicon wafer status
At present, China's semiconductor wafer suppliers mainly produce 6-inch and below silicon wafers. The 8-inch (200mm) products are produced by only a few manufacturers such as Beijing Research Institute, Zhejiang Jinrui, Kunshan Zhongchen (Taiwan Universal Wafer Subsidiary). In terms of 8-inch wafers, the mainland has a monthly production capacity of 700,000 pieces per month, and the capacity under construction is 265,000 pieces per month. The 8-inch production capacity includes Zhejiang Jinrui, Kunshan Zhongchen (Taiwan Universal Wafer Subsidiary) and Beijing Research Institute, with a total monthly capacity of 93,000 pieces/month, which is far from meeting demand.
For 12-inch (300mm) wafers, China's current total demand is about 420,000 pieces/month, and it is estimated that it will be 1.09 million pieces/month by 2018. At present, China mainland does not have the production capacity of 300mm electronic grade silicon wafers. At the end of 2017, Shanghai Xinsheng Semiconductor is expected to complete the first phase of production, with a planned monthly production of 150,000 pieces and the second phase of products by 2020. It is put into production and plans to produce 300,000 pieces per month, which is still far from enough compared with the huge demand. 
The company was established by Shanghai Xinyang, Xingsen Technology, Shanghai Silicon Industry Investment Co., Ltd., and Shanghai Xinxin Investment Management Co., Ltd. (the core technical team headed by Zhang Yujing). In June 2016, Shanghai Silicon Industry Investment Co., Ltd. increased its capital to become the largest shareholder's shareholding ratio of 42.31%, followed by Shanghai Xinyang (24.36%) and Xingsen Technology (20.51%). Shanghai Haoxin Investment Management Co., Ltd. (12.82%).
The first phase of Xinsheng Semiconductor is expected to start mass production at the end of 16 years. At the end of 2017, the monthly production capacity will be 150,000 pieces. The final monthly capacity will be 150,000 pieces of 12 inches and 50,000 pieces of 8-inch wafers, which is expected to be 2021-2022. It will form a production capacity of 600,000 pieces of silicon wafers of 600,000 pieces per month, with an annual output value of 6 billion yuan, reaching the world's advanced level.
The first phase of Xinsheng Semiconductor aims to research and develop 300mm silicon single crystal growth, wafer processing, epitaxial wafer preparation, wafer analysis and other silicon wafer industrialization complete mass production technology for 40-28nm nodes; The production base of 300mm semiconductor wafers realizes the localization of 300mm semiconductor wafers, which fully meets the urgent requirements of China's very large-scale integrated circuit industry for silicon substrate materials.
The company plans to produce: 300mm polished sheet, annealed sheet, epitaxial wafer, Monitor Wafer, Test Wafer and SOI substrate wafer. The core team of Xinsheng Semiconductor is composed of senior experts and various professionals from mainland China, Taiwan, Japan, the United States, South Korea, Europe and other countries and regions. They are the first-class technical and management talents in the semiconductor wafer industry. Has many years of experience in the development and production of 300mm large silicon wafers.
(2) Shanghai Xinao Semiconductor Shanghai Xinao Technology Co., Ltd. was established in 2001, led by Shanghai Microsystems of the Chinese Academy of Sciences, and established by Chinese and foreign investors. Since the establishment of Academician Wang and his team, he has been focusing on SOI. In June 2009, the overall change system was Shanghai Xinao Technology Co., Ltd., which is a high-tech enterprise dedicated to the research and development and production of high-end silicon-based materials.
In December 2010, the new plant in the new North Zone was completed and put into operation. At present, the new EPI production capacity has been more than doubled, and SOI production capacity has also been scaled up. And both businesses have broken through 8-inch technology and industrialized. On May 23, 2014, Xinao and France Soitec (the world's seventh largest semiconductor wafer factory in 2015) reached a strategic cooperation agreement and launched international industrial cooperation. In September 2015, Xinao cooperated with Soitec to successfully prepare the first 8-inch SOI wafers based on hydrogen injection layer transfer technology.
Xinao is currently the largest SOI material production base in China and one of the world's leading providers of SOI materials. With SIMOX (oxygen isolation), Bonding (bonding) and Simbond (completely self-developed SOI new technology) and Smart-cut four types of SOI wafer manufacturing technology, can provide 100mm (4 inches), 125mm (5 inches) and 150mm (6-inch) SOI wafer and SOI epitaxial wafers for 8-inch SOI wafers in batches.
Xinao's rich products cover all application areas of SOI, and its product quality and technical capabilities are recognized by internationally renowned companies. At present, more than 90% of Xinao's products are sold to the United States, Japan, Europe, Russia, Korea, Taiwan and Singapore, and become available to internationally renowned companies such as NXP, TOSHIBA, Global Foundries, Vanguard, Hitachi, CSMC, and Mellanox. Freighter.
Xinao is currently the leading EPI wafer supplier in China. As the first joint venture extension manufacturer in China, Xinao can provide epitaxial silicon products and epitaxial processing services of all specifications and requirements of 4-6 inches, and has begun to provide 8-inch epitaxial wafers in batches. The company's extended customers are now available in the United States, Japan, South Korea, Taiwan, Russia, India and other countries and regions, including Japan's Mitsubishi, Sharp, VISHAY, China Resources Shanghua and other internationally renowned companies.
(3)Zhejiang Jinruiqi Zhejiang Jinrui Technology Co., Ltd. is a high-tech enterprise dedicated to the research and development and production of semiconductor materials. It was founded in June 2000 and is located in Ningbo Free Trade Zone. In November 2011, it was renamed by Ningbo Lili Electronics Co., Ltd. Come. The semiconductor industry with the most complete industrial chain of silicon single crystal ingots, silicon abrasive sheets, silicon polishing sheets, silicon epitaxial wafers and power chips.
In 2003, in conjunction with the State Key Laboratory of Silicon Materials of Zhejiang University, China successfully produced the first 12-inch nitrogen-doped silicon single crystal for VLSI with independent intellectual property rights. The company's main products are high-tech, high value-added silicon wafers of various sizes. Among them, 8-inch polished wafers and epitaxial wafers began mass production and sales in 2009, which is the first to achieve zero breakthrough in China's 8-inch wafer positive film supply.
Products are widely used in integrated circuits, discrete devices and other fields, about 40% are sold to well-known wafer manufacturers in the United States, Europe, Singapore, Japan, South Korea and Taiwan, including ONsemi, Fairchild, IR, TI, NEC Such as internationally renowned companies, but also an important supplier of domestic related companies such as SMIC, Hua Hong NEC, Shanghai Advanced, Suzhou Hejian, Hangzhou Silan.
(4) Luoyang Monocrystalline Silicon Luoyang Monocrystalline Silicon Group is a high-tech enterprise invested by the state to provide silicon materials for scientific research, information industry and new energy industry. Its predecessor was Luoyang Monocrystalline Silicon Factory. In 1998, it was reorganized into Luoyang Monocrystalline Silicon Co., Ltd. In August 2014, it was renamed Luoyang Monocrystalline Silicon Group Co., Ltd. At present, Luodan Group has three subsidiaries: Meske Electronic Materials Co., Ltd., Luoyang Ledan Trading Co., Ltd., Henan Luodan Semiconductor Technology Co., Ltd.
Founded in 1965, Luoyang Monocrystalline Silicon Factory was the first state-owned large-scale silicon material manufacturer to introduce technology and equipment from Japan. In 1995, Messi Electronic Materials Co., Ltd., a joint venture between Luodan Group and MEMC Corporation (the predecessor of SunEdisonSemiconductor), was the first Sino-foreign joint venture in the domestic wafer manufacturing industry.
In August 2000, Luodan Group was placed under the jurisdiction of Henan Province and became a provincial-owned large-scale state-owned enterprise managed by the State-owned Assets Supervision and Administration Commission of the People's Government of Henan Province.
In June 2013, the project to relocate and expand the 120M square inch/year circuit-grade silicon polishing sheet was started. The total investment of the project is 1.098 billion yuan, covering an area of ​​150 mu. In October 2014, the infrastructure was transferred to the online commissioning and commissioning phase of the equipment. After the project is completed and put into production, it can produce 1.12 million pieces of 5-inch circuit-grade silicon polishing sheets and 3.6 million pieces of 6-inch circuit-grade silicon polishing sheets. It has the ability to develop and produce 8-inch silicon polishing sheets, and can realize 50,000 pieces. / 8 inch silicon polishing pad production capacity.
The leading products of Luodan Group are semiconductor circuit-grade silicon single crystals and silicon polishing sheets, which are widely used in scientific research and information industry. It has successfully developed more than 10 technologies, such as the production process of the first batch of 4, 5, and 6-inch back-sealing polishing sheets in China, which has filled the blank in the field of semiconductor silicon material processing in China. The product has been successfully used in several tests such as launch vehicles, intercontinental missiles, satellite launches and nuclear submarines.