Circuit boards are usually very hard, but American and Chinese researchers have developed a thin, flexible circuit board that is conceptually made into a "smart bandage" that can be attached to the skin to monitor a variety of physiological signals. A cover article published in the British "Nature · Electronics" magazine on the 13th showed that this "smart bandage" is formed by stacking 4 layers of interconnected thin flexible circuit boards, and the overall size and thickness are similar to a 1 yuan coin.

The researchers said that the circuit board uses an “island-bridge” structure based on silicon elastomer, where “islands” are rigid small electronic devices, such as sensors, antennas, Bluetooth chips, etc .; “bridges” are stretchable copper The wire is used to connect the "islands", so that the circuit board can be stretched and bent without affecting its function.

Corresponding author of the paper, Xu Sheng, a professor in the Department of Nano-Engineering at the University of California, San Diego, said that the design difficulty is not to stack circuit boards, but to make current connections between the circuit boards.

Xu Sheng team found that traditional lithography and etching techniques are not suitable for stretchable elastomers. Therefore, they mixed silicone elastomers with black organic dyes, made circuits and stacked them, welded them with lasers, and finally filled with conductive materials. The circuit board thus obtained not only has normal functions, but also has the flexibility that traditional circuit boards lack.

The researchers said that the "smart bandage" made of this flexible circuit board has a wide range of uses and can be attached to different positions of the body to record electrocardiograms, electroencephalograms, eye movements, and muscle behaviors.

In addition, it can achieve wireless communication with a smartphone or laptop within 10 meters, and can also be used to remotely control the robotic arm.

The researchers said that after 6 months of continuous use of the device, its circuit performance and scalability did not decline.

Researchers from China University of Electronic Technology and the US Air Force Research Laboratory participated in the study.

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